Conductive pastes for Chip components

Metal Metal
Content
Firing
Condition
Application Properties Printing
Type
Remark
Ni 40~50
wt%
1000~1200 °C MLCC - Fine line resolution
- High electric properties
- Ni Size : 150nm ~ 600nm
Screen
Gravure
Adjustable on demand
- Rheology
- Sintering shrinkage
- Density
Cu 60~70
wt%
700~850 °C MLCC - Plating resistance
- Good reliability
Screen
Dipping
Ag 50~90
wt%
560~900 °C Inductor
PTC
Piezo
LTCC
- Fine line resolution
- High electric properties
- Good reliability
- Excellent adhesion
Screen
Dipping
Al 50~80
wt%
650~850 °C PTC - Excellent adhesion
- Good reliability
Screen
Ag/Pd 50~70
wt%
900~1200 °C Varistor
MLCC
Piezo
- Fine line resolution
- High electric properties
- Good reliability
Screen